OEM PCBA Klon Assemblée Service Aner PCB & PCBA Benotzerdefinéiert Electronics PCB Circuit Board

Spezifizéierung

PCB Technesch Kapazitéit

Schichten Mass Produktioun: 2 ~ 58 Schichten / Pilot lafen: 64 Schichten

Max.Dicke Mass Produktioun: 394mil (10mm) / Pilot lafen: 17,5mm

Materialien FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Bleifräi Montagematerial), Halogenfräi, Keramik gefüllt, Teflon, Polyimid, BT, PPO, PPE, Hybrid, Partiell Hybrid, etc

Min.Breet / Abstand Innenschicht: 3mil/3mil (HOZ), Bausseschicht: 4mil/4mil (1OZ)

Max.Koffer Dicke 6,0 OZ / Pilot lafen: 12 OZ

Min.Lachgréisst Mechanesch Bohr: 8mil (0.2mm) Laserbohr: 3mil (0.075mm)

Surface Finish HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion , ENEPIG, Gold Finger

Special Prozess Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partiell Hybrid, Partiell High Density, Back Drilling, and Resistance Control

PCBA technesch Kapazitéit

Virdeeler ---- Professionell Surface-Montage an Duerch-Lach Löttechnologie

---- Verschidde Gréissten wéi 1206,0805,0603 Komponenten SMT Technologie

----ICT(In Circuit Test),FCT(Functional Circuit Test)

---- PCB Assemblée Mat UL, CE, FCC, Rohs Genehmegung

---- Stickstoffgas Reflow Soldertechnologie fir SMT.

---- Héich Standard SMT & Solder Assemblée Linn

---- Héich Dicht interconnected Board Placement Technologie Kapazitéit.

Passiv Komponenten bis 0201 Gréisst, BGA a VFBGA, Leadless Chip Carrier / CSP

Duebelsäiteg SMT Assemblée, Fine Pitch bis 0,8mils, BGA Reparatur a Reball

Testen Flying Sonde Test, Röntgen Inspektioun AOI Test